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Gallery
We contribute to the Electronic Industry of tomorrow with our quality PCBs based on solid technology and diverse ideas.
System Development
¡ Hardware Development capability
| yDesign specz |
Research of Technical Trend,
Value Analysis Recommendation
(Cost/Lead-time/Quality), Test Method Suggestion. |
| ySchematic Designz |
Component Selection, Schematic Entry,MTBF calculation. |
| y ÊP z |
H8, SH series. etc |
| yPLDz |
ALTERA Stratix series, Cyclone series
XILINX Vertex series, Spartan series
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| yAnalogz |
A/D, D/A, Filter |
¡ Software Development capability
| yÊP softwarez |
C, VB, Assembler |
| yIP Technologyz |
IP, UDP, TCP, HTTP, TELNET |
| yCommunication Technologyz |
Analog, ISDN(BRI,PRI)
T1, T3, SONET,
SDH(STM-0,STM-1) |
¡ Equipment
OrCAD capture, Protel, System-Designer
Altera-MAX+PlusII, QuartusII, Xillinx-ISE
OEM/EMS
¡ Case Design
| yPlate metalz |
Sheet metal processing, metal cutting, Tooling and Molding |
| yresinz |
Rapid prototyping(Stereolithography, Laser Sintering, Fused Deposition),
Rapid Prototype Tooling(silicon-type, aluminum-type),Tooling and Molding |
| yFinishingz |
face plate, painting, plating, alumite treatment |
¡ Component Procurement, ¡ Assembly and Wiring
¡ EMC/Safety Certificate Acquisition,Vibration/Aging/Reliability Test.
¡ Support service, ¡ Translation and Documentation
¡ Equipment
yDesign/2Dz
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AutoCADiLT2006j |
| yDesign/3Dz |
Pro/ENGINEERiWILDFIREj |
| yetc.z |
Temperature and Humidity chamber, Electric measuring instrument. |
PCB Design
¡ PCB Design capability
PCI-EXPRESS, DDR2 Optical Module Device, CSPEBGA Device,Audio/Video Device, High-speed switching Device, High-Voltage 400V,@High-Current 30A, RF 5.8GHz.
¡ Schematic Design
¡ Transmission Line Analysis Reflection analysis
1.Overshoot@@@2.Undershoot 3.Ringing back@@4.Non Monotonic Crosstalk analysis, Clock wave analysis
¡ EMI Simulation
EMI-DRC, Resonants Analysis
¡ Equipment
| yAnalysisz |
MENTOR ICX, DEMITASNX |
| ySchematic Designz |
ZUKEN Design Gateway, OrCAD Capture, Protel, ZUKEN System/Designer |
| yPCB Designz |
CADENCE Allegro, SPECCTRA Router
ZUKEN Board/Designe |
| yCAM Editz |
VALOR Enterprise, ORBOTECH Genesis,ORBOTECH InCAM |
Fabrication
¡ Fabrication capability
| yClassz |
Single/Double side, MLB, High-MLB(42 layers), Stacked build up, SVH-board, Rigid Flexible |
| ySpecz |
Minimum Line/Space : 50/50Ê
Minimum VIA diameter : ³0.1(Mechanical)
Layer count : 2layers`42layers
Thickness : 0.2`6.2mm
Board size : 600~500mm
Impedance control : 28¶}10%, 50¶}5%
Aspect ratio : 21
Power board : 175Êm cupper foil |
| yMaterialz |
FR4, FR5, Polyimide, Halogen Free, etc. |
Assembly
¡ Assembly capability
| yClassz |
SMT, DIP |
| ySpecz |
Maximum size : S460~440mm
Thickness : 0.4`3.0mm
Parts size : chip 0603, 1005
@@@@@@ CSP/BGA 0.2mm pitch
@@@@@@ QFPETSOP 0.4mm pitch
Solder : Eutectic solder, Lead-Free solder
Etc : Press-fit connector
@@@ CSP/BGA rework
@@@ N2-Reflow |
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