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What We Do
Since starting the business in 1978,we have expanded our business field in order to respond to the many different needs of our customers.
We will develop our business collectively regarding PCB,from software design and hardware design to fabrication and packaging.
| System development |
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・Software Design
・Hardware Design
・ASIC/FPGA Design
・Case Design |
・Mock design product
・Assembly and Wiring
・Debug/Functional Test
・Reliability Test and Noise Test |
| PCB Design |
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・Schematic Design
・High Frequency Line Analysis |
・Power Supply Circuit |
| Fabrication |
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・Double Sided/Multi Layer PCB
・High Layer Count PCB
・Stacked Via/Build-up PCB
・Substrate |
・Controlled Impedance PCB
・High Aspect Ratio PCB
・Lead Free Solder applied, Non halogen PCB
・Halogen Free |
| Assembly |
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・0402/0201 Chip Packaging Assembly
・CSP/BGA, Flip-chip Assembly
・Wire Bonding |
・CSP/BGA Rework
・Component Procurement |
| Software and related |
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・Business application development
・Database construction |
・Network construction
・Translation and Document production |
| Off-shore procurement |
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・Fabrication
・Part Procurement |
・Electronics Manufacturing Services. |
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