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What We Do
Since starting the business in 1978,we have expanded our business field in order to respond to the many different needs of our customers.
We will develop our business collectively regarding PCB,from software design and hardware design to fabrication and packaging.
| System development |
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・Software Design
・Hardware Design
・ASIC/FPGA Design
・Case Design |
・Sheet Metal Processing
・Assembly and Wiring
・Debug/Functional Test
・Reliability Test and Noise Test |
| PCB Design |
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| ・Schematic Design |
・Transmission Line Analysis |
| Fabrication |
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・Double Sided/Multi Layer PCB
・High Layer Count PCB
・Stacked Via/Build-up PCB |
・Controlled Impedance PCB
・High Aspect Ratio PCB
・Lead Free Solder applied, Non halogen PCB |
| Assembly |
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・0402/0201 Chip Packaging Assembly
・CSP/BGA, Flip-chip Assembly |
・CSP/BGA Rework
・Component procurement |
| Software and related |
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・Business application development
・Database construction |
・Network construction
・Translation and Document production |
| Off-shore procurement |
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| ・Fabrication |
・Electronics Manufacturing Services. |
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